DIP Assembly PCBA
parameters1:NO MOQ
parameters2:FAST LEAD TIME

PCB Assembly is one of the company’s main activities. We are able to undertake a high-quality Printed Circuit Board Assembly on competitive prices and flexible conditions. We are a complete "one-stop" resource for printed circuit board assembly, including the SMT assembly,BGA assembly,through hole assembly and soldering assembly.We offer customers a broad range of component placement capabilities.

PCB Assembly service and technology:

Prototype PCB Assembly
SMT Assembly (Surface Mount Technology)
BGA Assembly ( Ball Grid Array)
DIP Assembly
Solderning Assembly
Box Build Assembly

Assembly production machines:

· 8 automatic Fuji SMT lines with both lead and lead free are available
· 2 DIP Dual wave soldering line
· 2 manual soldering production ine
Our capacity:
produce 220 million points Monthly

Component range:
0201s Technology

3216,2125,1608,1005, 0805,0603,0402,0201
Fine Pitch QFP to 0.2mm
BGA, BGA, Flip Chips, Connectors
BGA to 0.2mm

Copyright(C)since2017  Hongchuan Technology Co., LTD ( Winwin electronic )